• X-ray microfocus transmission images from different angles, the highest resolution reaches 5μm
• Solder spot weld inspection analysis
• Bubble Crack Defect Analysis
• Wall Thickness Analysis
• Circuit Wiring Analysis
• Dimensional measurement

• Sample materials: carbon materials, polymers, ceramics, aluminum-magnesium light metals, etc.
• Sample size: maximum 300mm(length)*300mm(width)*150mm(height)
• Sample weight: less than 20KG

• X-ray microfocus 2D images from different angles, the highest resolution is 2μm
• CT tomographic 3D image, tomographic imaging accuracy up to 2μm
• CT reconstruction volume data
• Data analysis reports including porosity, wall thickness, defect analysis, etc.
• Sample measurements, including length, angle, volume measurements

• Sample materials: various density grades of carbon materials, polymers, ceramics, aluminum-magnesium light metals, iron-nickel heavy metals, etc.
• Sample size: Φ300mm*600mm
• Sample weight: less than 30KG