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FXI-CT2250
Applications
● Small and medium metal parts
● Composite materials
● Power semiconductors
● Biological samples
● Ceramic devices
Features
▲ One machine with multiple functions to meet the needs of micro-focus and large-focus non-destructive testing
▲ The maximum load-bearing stage of the stage is 30kg, and the testable sample is 300X600mm
▲ Automatic positioning of the best resolution
▲ Rapid reconstruction, combined with high-precision reconstruction in designated areas, accurately analyze customer concerns
▲ 3D point cloud image slice extraction from any angle, accurate analysis
▲ Multi-scale 2D image enhancement, more prominent details
▲ The scanning process is simple and the reconstruction imaging is fast
technical parameter
| System parameters | Spatial resolution: >4μm |
| Minimum defect resolution: > 2μm | |
| Contrast Resolution: Less than 1% | |
| Measurement error: (1.5+L/200) μ m | |
| Radiation protection: <1μ Sv/h, in line with the national GBZ117-2015 standard | |
| Maximum sample diameter: 300mm | |
| Maximum sample length: 600mm | |
| Maximum weight of sample: 30kg | |
| X-ray source | Voltage: 225kV |
| Minimum focal spot: <4μm | |
| Type: open tube | |
| detector | Pixel matrix: 3072X3072 |
| Imaging area: 427mmX427mm | |
| Pixel size: 139μm | |
| Machine parameters | Equipment size: 1900mm (length) × 1100mm (width) × 1500mm (height) |
| Equipment weight: <2000kg | |
| Working environment: 0℃～40℃/ 5～90RH | |
| Software function | CT reconstruction and display, slice extraction display and analysis, DR real-time prediction |
detection image
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Applications
● Small and medium metal parts
● Composite materials
● Power semiconductors
● Biological samples
● Ceramic devices
Features
▲ One machine with multiple functions to meet the needs of micro-focus and large-focus non-destructive testing
▲ The maximum load-bearing stage of the stage is 30kg, and the testable sample is 300X600mm
▲ Automatic positioning of the best resolution
▲ Rapid reconstruction, combined with high-precision reconstruction in designated areas, accurately analyze customer concerns
▲ 3D point cloud image slice extraction from any angle, accurate analysis
▲ Multi-scale 2D image enhancement, more prominent details
▲ The scanning process is simple and the reconstruction imaging is fast
technical parameter
| System parameters | Spatial resolution: >4μm |
| Minimum defect resolution: > 2μm | |
| Contrast Resolution: Less than 1% | |
| Measurement error: (1.5+L/200) μ m | |
| Radiation protection: <1μ Sv/h, in line with the national GBZ117-2015 standard | |
| Maximum sample diameter: 300mm | |
| Maximum sample length: 600mm | |
| Maximum weight of sample: 30kg | |
| X-ray source | Voltage: 225kV |
| Minimum focal spot: <4μm | |
| Type: open tube | |
| detector | Pixel matrix: 3072X3072 |
| Imaging area: 427mmX427mm | |
| Pixel size: 139μm | |
| Machine parameters | Equipment size: 1900mm (length) × 1100mm (width) × 1500mm (height) |
| Equipment weight: <2000kg | |
| Working environment: 0℃～40℃/ 5～90RH | |
| Software function | CT reconstruction and display, slice extraction display and analysis, DR real-time prediction |
detection image
image 1
image 2
image 3
image 4
